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  UltraPrep III  

UltraPrep III

Details coming soon.

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  Omega Prep  


OmegaPrep

The OmegaPrep is an ultra-high resolution mill specifically designed for use in the evolving semiconductor market.

It is designed to thin die to 1 micron of remaining silicon thickness. The system is robust and rigid with an intuitive user interface that is easy enough for a beginner and flexible enough for an experienced user.
See PDF for more information.

       
  Ultra Prep  


UltraPrep

UltraPrep is designed to perform in-package die thinning and polishing, plus special machining functions for sample preparation.
See PDF for more information.