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  Omega Prep  

OmegaPrep II

Thinning warped die to a constant remaining thickness
An easy to use, automatic, machining system for all mechanical sample preparation needs.

• Die thinning and polishing
• Encapsulant and die attach removal
• Heat sink removal
• Substrate delayering
• Substrate removal
• Stacked die removal
• C4 ball exposure
• Die delayering
• BGA removal for PCB assembly rework
• Automatic leveling and surface profile measurement
• Simple sample mounting and alignment
• Recipes can be saved for later use
• All process and measurement data is saved and reported
See PDF for more information.

       
  UltraPrep III  

UltraPrep III

Thinning warped die to a constant remaining thickness
An easy to use, automatic, machining system for all mechanical sample preparation needs.

• Die thinning and polishing
• Encapsulant and die attach removal
• Heat sink removal
• Substrate delayering
• Substrate removal
• Stacked die removal
• C4 ball exposure
• Die delayering
• BGA removal for PCB assembly rework
• PCB editing
• Automatic leveling and surface profile measurement
• Simple sample mounting and alignment
• Recipes can be saved for later use
• All process and measurement data is saved and reported
See PDF for more information.

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  Omega Prep  

OmegaPrep

The OmegaPrep is an ultra-high resolution mill specifically designed for use in the evolving semiconductor market.

It is designed to thin die to 1 micron of remaining silicon thickness. The system is robust and rigid with an intuitive user interface that is easy enough for a beginner and flexible enough for an experienced user.
See PDF for more information.